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AB结构有机硅树脂的制备与性能研究

时间:2019-11-01 18:57来源:毕业论文
通过苯基三甲氧基硅烷与二苯基二甲氧基硅烷的水解共缩聚反应,向苯基硅树脂中引入后者,通过调整后者的加入量改善LED封装胶的柔韧性。从而制备出固化温度低、固化速度快、柔韧
摘要:有机硅树脂在众多领域得到了广泛的应用,原因是其优异的耐高温性和耐候性等性能。但是基本上以甲基或甲基苯基硅树脂为当前市售的主要有机硅树脂。要么必须提供高温和长固化时间,要么固化后的树脂柔韧性差。这严重影响了其应用范围。41756
    本课题是通过苯基三甲氧基硅烷与二苯基二甲氧基硅烷的水解共缩聚反应,向苯基硅树脂中引入后者,通过调整后者的加入量改善LED封装胶的柔韧性。从而制备出固化温度低、固化速度快、柔韧性良好的有机硅树脂封装胶。在实验中,通过各种性能的测试来判断有机硅树脂封装胶的物化性能,并测试了红外、核磁共振等来确定反应产物的分子结构。改性后的有机硅树脂封装胶在固化后的折射率、透明度等方面,性能均有了显著的提高。
毕业论文关键词:  苯基三甲氧基硅烷;二苯基二甲氧基硅烷;水解共缩聚;有机硅树脂封装胶
Study on Preparation and Properties of AB Silicone Resin
Abstract:Silicones have been widely used in a lot of fields because of its excellent properties such as resistance to high temperature, weather ability and so on.However, most of the silicones are methylsilicone and methylphenylsilicone presently, and their applications are limited for their poor flexibility or long curing time at high temperature.
In this paper, a kind of flexible LED packaging glue which only needs low curing temperature,short curing time was prepared from phenyltrimethoxysilane and diphenyldimethoxysilane by their hydrolysis and copolycondensation.This experiment is for the silicones packaging glue to make a modified, abandon the traditional epoxy resin packaging glue, use silicone as raw material, preparation of a better performance packaging material.In the experiment, judge the property of the encapsulated glue by various performance tests, and test the molecular structure of the reaction products by IR, nuclear magnetic resonance etc. Modified organ silicone resin encapsulation adhesive after refraction after curing rate, index of refraction,transparency and so on, the performance improved remarkably.

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KeyWords: Phenyltrimethoxysilane; diphenyldimethoxysilane;hydrolysis and copolycondensation;silicone resin package adhesive
 目录
1  绪论    1
1.1  LED封装胶的研究背景    1
1.2  LED封装胶的现状    2
1.2.1  POSS改性EP封装材料    2
1.2.2  有机硅封装材料    3
1.2.3  有机硅纳米复合封装材料    4
1.3  LED封装胶的特点    5
1.3.1  耐老化性好    5
1.3.2  透光率高    5
1.3.3  折光率高    5
1.4  LED封装胶的结构和性能    5
1.4.1  结构    5
1.4.2  性能    6
1.5  LED封装胶的应用原理及分析    6
1.6  有机硅封装材料的研究进展    7
1.6.1  有机硅改性环氧树脂LED 封装材料    7
1.6.2  有机硅LED 封装材料    7
1.7  研究目的及意义    7
1.8  主要研究内容    8
1.8.1  完成AB结构有机硅树脂的设计    8
1.8.2  完成AB结构有机硅树脂的制备    8
1.8.3  完成AB结构有机硅树脂的性能分析    8
2  实验    9
2.1  原料名称、规格和来源    9
2.2  实验用到的仪器设备    10
2.3  合成工艺    10
2.3.1  实验工艺路线    11 AB结构有机硅树脂的制备与性能研究:http://www.lwfree.cn/huaxue/20191101/41931.html
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